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Joining and bonding

Joining and bonding

Active Alignment and Bonding of CMOS-to-Lens for Adimec’s high-performance cameras

Adimec, a leading provider of reliable and high-performance industrial camera systems, is known for delivering crisp, clear images for the machine vision, global security, and healthcare applications. Achieving high accuracy during the alignment and bonding of CMOS sensors to lens systems is critical for ensuring optimal image quality. To accomplish this, Adimec was supported by Etteplan. By combining active alignment with bonding methods, Adimec creates metrology cameras that offer superior resolution and exceptional performance.

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