ETTEPLAN OYJ: ANNOUNCEMENT OF HYBRID BOND PAYBACK Stock exchange release - Published: 26.10.2011 - 07:30:00 Back to Releases ETTEPLAN OYJ, STOCK EXCHANGE RELEASE, OCTOBER 26, 2011, AT 07.30 A.M. ETTEPLAN OYJ, STOCK EXCHANGE RELEASE, OCTOBER 26, 2011, AT 07.30 A.M. ANNOUNCEMENT OF HYBRID BOND PAYBACK Etteplan Oyj issued a EUR 10 million hybrid bond on December 1, 2009. The coupon rate of the bond is 9.50% per annum. The bond has no maturity but the company may call the bond after two years. The company will pay the EUR 10 million capital as well as the accumulated 9.50% coupon rate according to bond terms and within the time limits of the bond terms on December 1, 2011. Hollola, October 26, 2011 Etteplan Oyj Board of Directors Additional information:Per-Anders Gådin, CFO, tel. +46 70 399 7929 DISTRIBUTION: NASDAQ OMX Helsinki Major mediawww.etteplan.com Etteplan is a specialist in industrial equipment engineering and technical product information solutions and services. Etteplan’s engineering expertise and service products cover the entire life cycle of the client’s products. Our customers are global leaders in their fields and operate in areas like the automotive, aerospace and defense industries as well as the electricity generation and power transmission sectors, and material flow management. Etteplan has comprehensive competence in electronics and embedded systems development, automation and electrical design, mechanical design and technical product information solutions and services. In 2010, Etteplan had turnover of EUR 104.8 million. The company currently has approximately 1,600 experts in Finland, Sweden, and China. Etteplan's shares are listed on NASDAQ OMX Helsinki Ltd under the ETT1V ticker.